Semiconductor integrated circuit package

Abstract

PURPOSE: To obtain a package which can serve as both a normally bent package and an inversely bent package. CONSTITUTION: External connection lead frames 3 extending from the side face of a package molding resin 5 are formed into a symmetrical shape so as to protrude from both the upside and the underside of the molding resin 5, whereby the package concerned can be mounted on either of upside and underside of a printed wiring board 6. COPYRIGHT: (C)1992,JPO&Japio

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Cited By (3)

    Publication numberPublication dateAssigneeTitle
    US-5723903-AMarch 03, 1998Hitachi, Ltd., Hitachi Vlsi Engineering CorporationThin type semiconductor device, module structure using the device and method of mounting the device on board
    US-5895969-AApril 20, 1999Hitachi, Ltd. And Hitachi Vlsi Engineering Corp.Thin type semiconductor device, module structure using the device and method of mounting the device on board
    US-6114759-ASeptember 05, 2000Nec CorporationSemiconductor package